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Model Number : XCZU3EG-2SFVA625I
Payment Terms : D/A, T/T, Western Union
Delivery Time : 1-2 work days
Packaging Details : Tape & Reel (TR)
RAM Size : 256KB
Package / Case : 625-BFBGA, FCBGA
Packaging : Tray
Supplier Device Package : 625-FCBGA (21x21)
Number of I/O : 180
Speed : 533MHz, 600MHz, 1.3GHz
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Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
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Detailed Description: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 625-FCBGA (21x21) |
Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Primary Attributes: | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Series: | Zynq® UltraScale+™ MPSoC EG |
Architecture: | MCU, FPGA |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Common Problem
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XCZU3EG-2SFVA625I Integrated Circuits ICs IC FPGA 180 I/O 625FCBGA Images |