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XCZU11EG-2FFVC1156E Integrated Circuits ICs IC FPGA 360 I/O 1156FCBGA

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XCZU11EG-2FFVC1156E Integrated Circuits ICs IC FPGA 360 I/O 1156FCBGA

Model Number : XCZU11EG-2FFVC1156

Payment Terms : D/A, T/T, Western Union

Delivery Time : 1-2 work days

Packaging Details : Tape & Reel (TR)

Packaging : Tray

Supplier Device Package : 1156-FCBGA (35x35)

Number of I/O : 360

Speed : 533MHz, 600MHz, 1.3GHz

Lead Free Status / RoHS Status : Lead free / RoHS Compliant

Detailed Description : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

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We can supply XCZU11EG-2FFVC1156E , send us a request quote to request XCZU11EG-2FFVC1156E pirce and lead time.https://www.henkochips.com

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The price and lead time for XCZU11EG-2FFVC1156E depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part XCZU11EG-2FFVC1156E.We look forward to working with you to establish long-term relations of cooperation

Flash Size:	-
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL):	4 (72 Hours)
Manufacturer Standard Lead Time:	10 Weeks
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes:	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Series:	Zynq® UltraScale+™ MPSoC EG
Architecture:	MCU, FPGA
Operating Temperature:	0°C ~ 100°C (TJ)
Peripherals:	DMA, WDT

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